The one and lonely
Image Sensor Lexicon ©
compiled by Bart Dierickx, version 12JAN2012.
|
1.75T and 1.5T pixels |
Are “shared” pinned photodiode pixels
(see 4T) organized in groups of typically 2 or 4, whereby the floating
diffusion is common.
E.g. a group of 4 pixels, having 4 transfer gates, and 1 reset, 1
source follower and 1 column switch, have 7/4= 1.75 transistors per pixel. |
|
1/f noise |
Temporal noise with a
dominantly low frequency content. In this context its physical is
typically in MOS or MOSFET interface states. Synonym of flicker noise.
|
|
1T pixel |
Consisting of one photodiode and one
access MOSFET, the simplest passive pixel. |
|
2T pixel |
Two 2T pixels have had some limited
success in the past Ž
Hitachi’s 2T pixel is a variant of the passive 1T pixel, with two
switches in series, which allows a faster readout and a better FPN
cancellation Ž
Toshiba’s 2T pixel is a variant of the 3T active pixel, not needing a
select switch. Row selection is done
by the supply line to the source follower transistor. |
|
3T pixel |
Most classic and most straightforward
active pixel, having three (3) transistors (T)(MOSFETs)
and one photoreceptor. One MOSFET resets the photoreceptor; the second
is a source follower sensing and buffering the photoreceptor node voltage;
the third is the row selection switch. |
|
4T pixel |
There exits several types of four transistor pixels. Ž
The best known 4T pixel is also known as the pinned diode pixel. Take a
3T pixel, and extend the
photodiode/floating diffusion node with a transfer gate and a
pinned photodiode. Ž
Another 4T pixel is the charge-skimming (or direct-injection) pixel,
which is also a 3T pixel, where a 4th MOSFET is placed between the
photoreceptor and the voltage sense node to increase the charge to voltage
ratio. This topology is almost
identical to the pixels above, except that the photodiode charge cannot be
completely evacuated. Often used in
hybrid IR FPAs. |
|
absorption depth |
Light, as all electro-magnetic radiation,
is absorbed (thus detected!) in Silicon over a characteristic 'absorption'
depth. Blue light is absorbed in about 0.5 to 1 um; green light in a few um;
red light in a layer over 5 to 10 um thick. Infrared light is absorbed in
deeper layers. Ultraviolet light is typically absorbed (thus not detected!)
in the top oxide layers. |
|
active pixel |
Pixel, containing an active (= power
dissipating) element. In most cases the active element is a MOSFET in an
amplifying or buffering configuration. The presence of only one MOSFET acting
as a switch only does not make a pixel 'active'. |
|
active reset |
Methods to reset a pixel, that results
in kTC noise reduction based in sensing and feeding back to the sense node
voltage during the reset operation. |
|
ADC |
Analog to Digital Converter: An
electronic circuit that converts an analog voltage, as comes out of an imager
core, into a digital signal. |
|
alchemy or black magic |
The part of our science that nobody
really understands, but that seems to work well until someone changes a tiny
detail in some arcane procedure. |
|
Anna Karenina-effect |
The observation that one cannot make one
real general purpose image sensor (or anything else) that is “good” for all
specifications. One-size-fits-all does
not work as so easily a spec will fail. In the novel by Tolstoy, the opening
sentence claims that there is only one type of happy (ideal) family, and
innumerable ways to be an unhappy family. |
|
anthropomorphic |
Properties of image sensors that are inspired
by, or similar to, properties of the human (- eye). Examples: logarithmic
response, RGB sensitivity, and log-polar geometry. |
|
Anti-blooming |
A feature in both CCD and CMOS pixels
that counteracts “blooming”. |
|
APD |
Avalanche Photo Diode. Photo diode constructed such that it can
be operated in “Geiger mode”, i.e. it can be biased beyond its breakdown
voltage, and breakdown will only happen triggered by the absorption of a
photon. This breakdown can be used in
photon counting. See also SPAD. |
|
APS (1) |
Active Pixel Sensor: Image sensor using
active pixels. |
|
APS (2) |
Advanced Photo System: small format
film, 30.2 x |
|
ARC |
Anti-Reflective Coating: Dielectric layers
on top of the receptor with specific thickness and refractive index, so that
only a minimal fraction of the light impinging on the receptor is reflected. |
|
area sensor |
Imager with a two dimensional array, or
matrix, of pixels. |
|
auto-saturation time |
The average time for a pixel to saturate
due to dark current alone, i.e. non-illuminated. The absolute upper limit for
useful integration time. |
|
Bayer pattern |
A popular type of Red-Green-Blue CFA,
invented by Brice E. Bayer (Kodak). |
|
binning |
charge binning A mode of operation that is available
only in some types of CCD (FTCCD). The charge of multiple pixels is
accumulated and read in a single operation. This type of binning has no noise
penalty. Binning is sometimes emulated in passive pixels, active pixels or in
the digital domain. But here the noise advantage is less prominent. Charge
binning can also be done in shared pinned photodiode pixels. |
|
BLIP |
Background Limited Integrated
Performance: Camera operation in a condition where the noise is dominated by
the inherent shot noise in the background illumination level. Used in IR
imaging. |
|
bolometer |
Radiation detector sensor/pixel based on
the change of temperature due to radiation absorption. The change in temperature is sensed and
readout through a strongly temperature dependent resistance. |
|
BSI/BST |
backside illumination and backside thinning. An imager can be illuminated from the
backside, if the silicon can be uniformly thinned to a few micrometers. If
successful, there is no obstruction of the light by metallization and
dielectric layers, and the fill factor and UV sensitivity can be very high. |
|
bulk |
Substrate. With MOSFETs, the symbol for
bulk or substrate is B. |
|
bulk effect |
Normally the source-drain current
through a MOSFET is regulated by the gate potential. Nevertheless, the bulk
potential has a generally unwanted parasitic effect too. |
|
buried channel |
Similar to a MOSFET inversion layer, but
by the proper game of implantations the charge is separated from the
interface. The better "buried channel"
CCDs store and transfer their charge in a buried channel under the
electrodes. |
|
Buried diode |
Photo diode which by an additional
junction/implant is separated from the Si-SiO2 interface. This
implant pins the interface potential to a fixed value, likely the substrate
potential. Its main effect is a
reduced dark current, as it electrically separates the interface dark current
generation centers from the collecting junction. |
|
Caeleste |
Caeleste CVBA, image sensor design
house, specialized in high-end space, medical and industrial image sensors.
For the origin of the name, see www.caeleste.com/name.html
|
|
CameraLink |
a
historic serial communication protocol and cable format designed for computer
vision applications. Successors to CameraLink
are GigE,
10GigE, HDBaseT™, emcore, CoaxPress, LAG, USB3, … |
|
CCD |
Charge Coupled Device: Originally the
name of a structure invented in 1970 of adjacent MOS gates
("electrodes") that allows both confinement (storage) and transport
of free charge. Later the name of the modified MOS technology in which the
device is made. Even later the name of image sensors based on the CCD
principle. And finally, sometimes, the generic name of a solid state image sensor.
|
|
CDS |
Correlated Double Sampling: A method to read the differential
magnitude of a charge packet, thereby canceling a source of FPN, as well as
the kTC noise that is caused by the reset of the charge packet. |
|
CFA |
Color Filter Array: the mosaic of color
filters overlaid on the pixel array. |
|
CFD [fF] |
Floating diffusion capacitance. |
|
CFT |
Contrast Transfer Function: MTF
multiplied by S/N. An attempt to define an image sensor quality factor that
favors both sharpness and contrast. |
|
charge skimming |
Also named "direct injection",
is a technique to sense charge with a high charge-to-voltage conversion
ratio. The photodiode (or photo resistor) is at the source of a DC-biased
MOSFET. The charge is integrated at the drains side of the MOSFET. Is used in
the classic 4T pixel. |
|
cheerleader effect |
A classic misconception that nature
systematically compensates bonuses by flaws. e.g.
that beautiful girls must be dumb; that smart people must be nerds or
socially inapt; that CMOS image sensors must be low end. |
|
CID |
Charge Injection Device: CCD-based
technique and image sensor using this technique. Detection based on local
charge transfers only and non-destructive read out. |
|
CIE diagram |
Two-dimensional [x,y] representation of [X,Y,Z] color space. It can
represent all physical colors (and even more!). I.e. any combination of
monochromatic wavelengths, which is much more than what can be generated with
a set of three primaries (typically R,G,B). All
colors that can be generated by the linear combination of such primaries form
a color triangle. |
|
CIS |
CMOS Image Sensor |
|
CMD |
Charge Modulation Device: Image sensor technology
based on the detection and charge sensing in isolated bulk (B) node of a
(buried channel) MOSFET. |
|
CMOS |
Complementary MOS: The mainstream mass
manufacturing Silicon technology. Characterized by the fact that both nMOSFETs and pMOSFETs ("complementary"
pairs) can be manufactured on the same wafers. |
|
CoB |
Chip On Board: Mounting the image sensor
chip directly on the PCB, without package. Cheap but a bit fragile, unless
well protected. |
|
co-integration |
Answer to the question: shouldn’t we put
a larger part of the system (digital or analog) on the same chip as the
analog imager core? |
|
color |
human subjective experience of pure or a mixture of monochromatic
wavelengths. |
|
color reconstruction or
demosaicing. |
The raw image from an imager with CFA
has only one color component per pixel. Trivial or more
clever reconstruction algorithms must restore the missing color
components for every pixel. |
|
column amplifier |
Charge amplifier or voltage amplifier
that is located at the edge of columns of pixels. Serves to buffer or sense
the signal of one, selected, pixel in the column. Typically, the signals of
the column amplifiers are multiplexed to one imager core output. |
|
CoM |
“Conservation of Misery”. When you improve on one parameter (say,
noise), you will inevitably sacrifice another parameter (say power, area,
speed, design time, profit, salary…). It does not work the other way around:
when you deliberately worsen say, noise, power, speed or your salary will not
improve. Has
some affinity with the Laws of Thermodynamics (conservation of entropy), the
Law of Murphy and the Anna Karenina effect (see above). |
|
cosmetic defect |
As a spot or a mark in the face. Small defects,
localized non-uniformities, unwanted patterns, blemishes, dust particles,
etc. that degrade the image quality. |
|
cosmic radiation |
see X-rays |
|
CRT |
Cathode Ray Tube: The ancient display device, used in TV and computer monitors. Now largely
replaced by LCD. |
|
CTIA |
Charge Trans-Impedance amplifier.
Amplifier, not in the sense of voltage multiplier, but in the sense of
translating the signal to a different domain, in casu,
charge to voltage domain. A "charge-to-voltage" amplifier thus. The
classic full-bred CTIA is an inverting amplifier with a capacitor in the
feedback; but simply storing a charge on a (parasitic) capacitance, and
reading the voltage with a source follower, as in the 3T pixel, is also a
CTIA in principle. |
|
cushion effect, cushioning |
light flux projected through a lens is more attenuated at the sides and
corners of the image. The response over the image area has the shape of a
pillow / cushion. The effect is caused by the reduced angle of incidence away
from the image center, and by the non-Lambertian
absorption of the imager. Is modeled by cos2 to cos4
laws. Extreme cushioning is called “vignetting”.
Sometimes also pincushion- or barrel distortion is called cushioning. |
|
Specific detectivity.
A figure of merit for the capability of a receptor or receptor technology,
which is invariant for area and integration time. |
|
|
DAC |
Digital to Analog Converter: as ADC, but
read the explanation back to front. |
|
|
dark current The parasite of photocurrent. In the
absence of light, a non-zero current will flow in the photodiode, spoiling
the image and adding its own shot noise. Typically expressed in [pa/cm2],
in [electrons/second] or in [V/s] (see dark signal). |
|
demo-effect |
from “demolition-effect”.
An empirical law stating that nice setups often fail at or just before an
important person coming to see it. See
also CoM. |
|
demosaicing |
See color reconstruction |
|
detector |
"Detecting" apparatus. Most
people don't tell the difference with "sensor". Sounds more
"active" than "sensor" - or does it sound more expensive?
The nuclear physics community considers a detector as the bigger apparatus
containing many smaller "sensors". In hybrid FPAs the detector is
the non-Silicon part. |
|
dicing |
Dividing a wafer into dice by
scribing/breaking or sawing |
|
die |
die (plural: dice): rectangular piece of
semiconductor material, thus more or less a synonym for “chip”. |
|
dielectric layers |
Insulating, transparent (?) layers on
top of the IC. Typically SiO2, SiN.
Recently "low-k" dielectrics (polymers, black diamond, porous materials)
are being introduced to lower the inter-metal capacitance for high speed and
RF applications. |
|
diode |
Electronic device with two terminals, that conducts the current in only one
direction. Originally a two-terminal vacuum tube, invented by Edison in 1880.
Nowadays it consists of a p-n junction, the juxtaposition of an n-type
semiconductor and a p-type semiconductor, typically on the same substrate. |
|
double slope integration |
Method to extend the dynamic range of a normally
linear-transfer imager, by combining the images taken with a long and a short
integration time into one image. The resulting electro-optical transfer curve
is bi-linear. |
|
DQE |
Detective quantum efficiency [%]. Quality factor used of X-ray detectors,
combining the absorption, S/N ratio and MTF. |
|
|
Dark signal. The signal due to dark
current, expressed in [V/s]. |
|
DS |
Double Sampling or Uncorrelated
Double Sampling: A method to read the magnitude of a charge packet, canceling
a main source of FPN, but not the kTC noise. |
|
dSNR dS/dN |
Differential or incremental or “AC” S/N
ratio. Similar to S/N *but* the signal
is considered explicitly as the small signal fit to the non-linear S/P (signal/power,
or response) curve. dSNR is lower than SNR when
considering the typical non-linearities seen in
real systems. |
|
DSNU |
Dark Signal Non Uniformity, expressed in
[V/s]RMS or VRMS. The spatial
noise due to the pixel-to-pixel non-uniformity of the dark current. |
|
DSP |
Digital Signal Processor:
software-programmed or hardwired logic device,
specialized in performing many calculations at high speed on a signal. The
raw image coming from an imager can be/needs to be post-processed in the digital
domain. |
|
dummy pixels |
A pixel array features some rows/columns
of real but unused pixels at its perimeter, thus ensuring that the
"useful" pixels are not affected by peripheral circuitry. |
|
DR |
dynamic range. ratio of highest non-saturating optical flux on the smallest detectable
flux for a sensor. Is equal to the SNRmax
if and when the sensor features a linear transfer curve. |
|
electron |
Elementary particle with negative unit
charge. |
|
electronic shutter |
A method to operate an electronic image
sensor in a way that the effective integration or exposure time (shutter
time) is variable. The result is the same as that of the mechanical shutter
found on the classical photo camera. |
|
EM |
Electro-Magnetic radiation: Visible
light is just one small part of the huge EM spectrum. |
|
EMC |
Electro-Magnetic Compliance: the
property to emit no (or little) radio wave EM radiation, or to be insensitive
for spurious EM radiation or EMI. |
|
EMI |
Electro-Magnetic Interference: System
noise. |
|
epi wafers |
Epitaxial wafers. Most CMOS image sensors
need processing on highly doped wafers with on top a few microns thick
"epitaxial layer" of lowly doped silicon. |
|
in many
cases still the reference in electronic vision. Superb image quality mostly
thanks to the huge image correction engine behind it. |
|
|
f number |
(sometimes written as f# or f/#) Ratio
between the opening (diameter) of the lens and its focal length. A high
f-number means a large attenuation of the light power. A low f number is
beneficial for low light imaging, but low f-numbers have also low depth of
focus and are vulnerable to lens imperfections: |
|
FD |
floating diffusion. Circuit technique for the conversion of
(photo) charge to a voltage, on a (not tied to a DC voltage, thus “floating”)
junction (junctions were historically created by impurity diffusion). Used in most CCDs and
APSs. Invention attributed to Walter Kosonocky, but disputed to have been foreseen by Boyle
and Smith in the original CDD invention. |
|
FEA |
Field Emission Array: Micro-machined
silicon device that combines the light detecting mechanism of a Vidicon tube and the circuit possibilities of an
integrated circuit. |
|
FEE |
Front-end electronics. The driving electronics that resides
close to the FPA. |
|
FF CCD |
Full Frame CCD: A FT CCD lacking storage
area. Needs an external shutter. |
|
fill factor |
FF: ratio [%] of the light sensitive
area of a pixel on its total area. Should be quoted in conjunction with
spectral response. |
|
FillFactory |
Flemish image sensor design house,
active from 2000 till 2004
focusing on custom-designed and standard CMOS Image Sensors.
Predecessor of Caeleste. |
|
FireWire |
FireWire or IEEE-1394: industry standard
high speed serial link |
|
flux |
Light power per unit area [W/m2].
Light intensity. |
|
FPA |
Focal Plane Array. The image sensor as placed in the focal
plane of a telescope. |
|
FPN |
Fixed Pattern Noise, or spatial noise.
Is the unwanted static (DC) variation of the response of all pixels in the image. Expressed as an offset in volts or in ADC bits. |
|
frame |
The electronic form of one image. |
|
frame rate |
The frequency at which consecutive
images are taken by a camera. |
|
frame time |
The time it takes for an imager to
capture and output an image and be ready for the next frame. Equals 1/frame_rate. |
|
FT CCD |
Frame Transfer CCD. |
|
G |
gate Control terminal of a MOSFET. In a CCD
the gates are called "electrodes". |
|
gamma |
Response correction in cameras
originally introduced to counteract the non-linear response of CRTs. The
typical gamma correction takes the signal - or each of the R, G, B components - to the power of 0.45. |
|
gamma rays |
see X-rays |
|
GND |
Ground. The zero reference voltage in
most electronic circuits. In our science it is typically defined as equal to the
substrate voltage, sometimes simplistically called substrate potential. |
|
gray [Gy] |
SI unit of radiation dose, used in X-ray
and particle imaging. A dose of 1Gy
corresponds to a radiation energy of 1J deposited in
1kg of material (body tissue). For a relation between dose
in Gy see here. |
|
handshake |
Motion blur due to the shaking of the
hand of the photographer. |
|
handshaking |
Feature of many transmission protocols, for
establishing the data channel or to acknowledge correct receipt. |
|
hole |
In a semiconductor the local absence of
a bound electron, acting to all intents and purposes as a free charged
particle with positive unit charge, and thus opposite of a negatively charged
free electron. A hole is absolutely not the same as a positron, the
anti-electron, which also has a positive unit charge, but which is a real
physical (but rare, and thus expensive) particle. |
|
horror vacui |
Fear of emptiness (Latin). The natural
fear of an image sensor designer for empty silicon, and her/his
insuppressible desire to fill this space with circuits, test structures,
yield killers, logos, etc. |
|
hue |
A number indicating the spectral
component of a color. The "H" in LHS. Scalar number indicating the
spectral component continuously from read-yellow-green-cyan-blue-magenta-red.
|
|
hybrid |
Imager consisting of a CMOS readout
array chip and a separate detector chip. |
|
IC |
Integrated circuit. An electronic circuit manufactured on
one piece of semiconductor. There may
be one or more ICs on a single die or chip. |
|
IL CCD |
InterLine CCD. |
|
image processing |
Digital domain operations in hardware or
software on images or image sequences. ·
"early" operators are intended to
convert the raw image from the imager to a "nicer" image. ·
"later" or "smart"
operators do something with the image contents. Typical "early" image
processing operators are: spatial and temporal filtering, non-uniformity
calibration, defect corrections, offset and gain correction, gamma
correction, color reconstruction, demosaicing, white balance, saturation and
hue correction, “matrixing”. Amongst "smart" operators are:
image compression, code recognition, image interpretation, segmentation,
correlation, feature recognition, automatic measurements, demodulation, time
gating, distance ranging, ... |
|
imager |
Combination of the words image and
sensor. |
|
imager core |
The essential part of an image sensor
chip. Nothing more than the pixel array and the immediate peripheral circuits
required to operate the pixel array. |
|
tint |
integration time Exposure time or electronic shutter
time. The time span during which light is being converted to charge and
accumulated in a pixel. |
|
intelligent image sensor |
Smart sensor. The real question is: what is
"intelligent"? The first image sensor that can give an answer to
that question is really intelligent. |
|
intensity |
radiative power per unit area; flux. Expressed in [W/m2]
or [lx] (see luminance) |
|
interface (1) |
In this science (CMOS technology) the
border between Silicon and whatever is on top. The favorite meeting place for
embarrassing things like dark current generation centers and 1/f noise
centers. |
|
interface (2) |
At system level it usually is the
hardware/software entity that links camera or camera chip to a system.
Examples: video (PAL, NTSC), FiWi, USB, CameraLink, ... |
|
interlacing |
In the CCIR (PAL) and EIA (NTSC) video
formats, the image information was divided in odd and even (sub) frames.
Alternating frames contain only the odd or even lines. Imagers for these
formats should read their lines in the same sequence. |
|
intrinsic or i-type
|
Undoped Silicon has (in theory) a low concentration of both holes and
electrons. To distinguish it from n- or p- type, it is indicated by "i". |
|
inversion layer |
Under the influence of an electric field
an n-type material can contain a majority of holes, and thus
"invert" effectively to p-type, or vice versa. The inversion layer
under a MOSFET gate is the conducting path of the MOSFET. |
|
IR |
Infra Red: EM radiation with wavelengths longer than the visible light.
|
|
IR cut-off filter |
Silicon photodiodes are sensitive for
light with wavelengths between 350 and 1100 nm. The human eye sees light with
wavelengths between 350 and 750 nm (the "visible spectrum"). An IR
cut-off filter is a piece of special glass, or another material, put in front
of the image sensor and absorbing or reflecting the light outside the visible
spectrum. Quite necessary for color sensitive imagers. |
|
ISO |
Empirical measure of the light
sensitivity or speed of photographic film. Transferring this to an electronic
image sensor spec is a real shot in the dark. See ISO standard 12232. |
|
junction |
The place where a two materials
join. In semiconductor diodes: the
border between the p- and the n- material. |
|
knife edge method |
A method to obtain the LFS, hence the
MTF, by illuminating a pixel over a sharp edge, as that of a knife. |
|
kTC |
Boltzmann’s constant * absolute
temperature * capacitance. The thermodynamic uncertainty on the amount of
charge left on a capacitor after disconnecting it from a DC voltage source. kTC noise is sometimes called “reset noise”. |
|
LCD |
Liquid Crystal Display: One type of flat
panel display, based on the light polarizing capabilities of so called liquid
crystals in an electric field. |
|
LHS |
luminance - hue - saturation: an alternate way to represent colors in a 3
dimensional space. Is more suitable for certain image processing algorithms
than the RGB space. |
|
linear response |
a light power (P) to voltage (V)
conversion that can be approximated by a linear relation as: V = something *
P. |
|
linear sensor |
Image sensor with a one-dimensional
array of pixels, i.e. one or a few rows of pixels. Don't confuse it with a linear response image sensor. |
|
logarithmic response |
A light power P to signal voltage V conversion
that can be approximated by a logarithmic relation as: V = something * log(P). |
|
log-polar geometry |
Arrangement of pixels, organized in
concentric circles, with a constant number of pixels per circle. The pixel
size is smallest in the center and grows towards the edges. This mimics the
human retina. |
|
LSF |
Line Spread Function: the Point Spread
Function (PSF, see there) projected on one dimension. MTF is the Fourier transform of the LFS or
PSF. |
|
luminance |
The human vision spectrally weighted
"light intensity" or "black&white"
component of a color image, or of a color video signal. The "L" in
LHS, the "Y" in YUV. Carries sharpness, contrast, dynamic, dark/light/grayscale. Luminance is proportional to light
power. The CIE notion "lightness" (L*) is a non-linear perceptual
derivate of luminance. The notion "Luma"
(Y') is a video-technique non-linear look-alike of luminance. |
|
lux [lx] |
Human eye equivalent (i.e. subjective) of
the objective light flux measured in W/m2. As the spectral
sensitivities of the eye and Silicon are not matched, there is no general
conversion factor between lx and W/m2. As a rule of thumb, consider 1W/m2 =
100lx (visible white light) to 250lx (visible + NIR). |
|
matrixing |
Early image processing operator that can
be described as a 3x3 matrix operation on the R, G and B color channels. It implies white balancing and
hue/saturation correction. |
|
micro lenses |
Technique to increase the fill factor of
pixels by giving each pixel a tiny individual lens that converges
all light on the even-tinier photodiode below it. |
|
MOS |
Metal Oxide Semiconductor: In medieval
times MOSFETs were made as a stack of Aluminum (metal) on SiO2
(oxide) on Silicon (semiconductor). Today the gate metal is in
most cases replaced with Polysilicon or Silicide Polysilicon, but the name persisted. (yet
in deep-deep-submicron processes, metal gates or fully silicided
gates might reappear again). |
|
MOSFET |
MOS Field Effect Transistor: transistor
type based on the MOS layer structure. The current between source (S) and
drain (D) passes through the inversion layer that is controlled by the
voltage at the gate (G). |
|
Motion blur |
Unsharpness in an image causes by the object, the scene, or the camera moving
during the integration time. |
|
MTF |
Modulation Transfer Function: Ratio
between the amplitudes of a sinusoidal pattern in the optical image and the
resulting electronic image. A measure for a pixel’s / sensor's
inherent sharpness of focus. |
|
multiple slope operation |
as double
slope, with more than 2 slopes. |
|
NA |
Numerical aperture. 2NA = 1/f# |
|
NDR |
Non-Destructive Readout. Mode of
operation of CCDs and CMOS image sensors, where the size of a charge packet is
read, without resetting it. This information can thus be read several times (oversampled),
so as to improve the S/N of the reading operation |
|
Noise Equivalent Power. In [W] or [WRMS] |
|
|
NIR |
Near InfraRed:
EM radiation between 750 and 1100 nm, invisible for the eye, but still
visible for Silicon. For non-Silicon
guys, NIR means 750-2000nm. See also SWIR. |
|
nMOSFET |
n-type MOSFET, a MOSFET in which the conduction between n-type source and
drain happens by electrons. |
|
noise |
A word with many meanings. In our
science it is the unwanted fluctuation of the signal of one pixel over time.
To differentiate from spatial/static noise it is sometimes called
"temporal noise" (N [VRMS] or Qnoise
[electrons]) |
|
n-type |
Under zero electric field and
equilibrium an n-type semiconductor contains a majority of electrons and few
holes. n-type Silicon is usually obtained by doping
with donor ions. |
|
Nyquist limit |
The Nyquist limit equals to the spatial
frequency 1/(2 x pixel pitch) of a pixel array.
Image information beyond this limit is "aliased" to lower spatial
frequencies. In practice this aliasing appears as Moiré effects and color
artifacts. |
|
optical cross talk |
Light impinging on a pixel can influence
the signal of neighboring pixels through various mechanisms: diffraction of
light, diffusion of photo charge towards the neighbor, or plain electrostatic
cross talk. Together these make up optical crosstalk. |
|
passive pixel |
Pixel not containing an active element,
so essentially a photodiode with access switches. The most obvious passive pixel is the 1T
pixel. |
|
photo diode |
All silicon diodes or p-n junctions are
sensitive to light. A diode that explicitly is designed for detecting light
is a photo diode. |
|
photo gate |
Light receptor made as a MOS structure.
Can be understood as a p-n photo diode, where one of the parts is the
inversion layer under the MOS. |
|
photo receptor |
or light
receptor. The light sensitive device in a pixel (in this science). Typically
a photodiode, a photo transistor or a photo resistor. |
|
photodiode array |
Image sensor consisting of an array of
passive pixels, where the passive pixels contain only a photodiode and a
multiplexing switch. |
|
photoelectric effect |
The basic mechanism of light detection
in any solid state imager. A quantum of energy from the impinging EM
radiation (a photon) excites a bound electron to an unbound state. |
|
photon |
The light quantum. The unit of energy
exchanged in a single interaction between EM radiation and a charged
particle. |
|
photon counting |
Detecting individual photons and
counting these events. |
|
PIN diode |
p-n diode
with a relatively important lowly doped (intrinsic) layer "i" sandwiched between the p-type and n-type
regions. Due to its deep collecting
volume suitable for IR and X-ray detection. Due to its thick depletion layer
having a low capacitance. |
|
pinned diode |
Buried (photo) diode with the additional
feature that it can be completely depleted, and thus emulate complete charge
transfer as in a CCD. |
|
pixel |
From picture
+ element. Originally the atom of a
photograph, of an electronic image, of an electronic display. In our
profession the atom of an image sensor. Minimally contains a receptor and
elementary means to feed the information to the outside world. |
|
plasma display |
Type of flat panel display, based on the
emission of light by the interactions of free electrons in an ionized gas
(plasma). |
|
pMOSFET |
p-type MOSFET, a MOSFET in which the conduction in the inversion layer
between p-type source and drain happens by holes. |
|
potential |
Local property of a position in space. Energy
that must be given to or taken from a hypothetical free electron to be stable
at that certain position. Is a relative measure, thus it must be referred to
some "reference". In absence of any reference the reference is the
potential in vacuum at an infinite distance. Ever tried? |
|
preview mode |
Mode of operation of a large, slow-scan,
imager: It is read at high frame rate but at reduced
resolution. “Video mode”. |
|
PRND |
Do not confound with PRNU. Seen on
automatic gear boxes in US cars. Park-Reverse-Neutral-Drive. |
|
PRNU |
Photo Response Non-Uniformity non-uniformity in the slope of the photo-electric transfer curve between pixels.
Also see spatial noise. |
|
PSD |
Position Sensitive Device: A solid state
optical sensor that outputs analog signals that are measures of the position
of a light spot on the sensor. |
|
pseudo-random CFA |
mosaic color filter array, where the colors are attributed to pixels in a
(pseudo) random way. The purpose is to suppress color-moiré or
color-aliasing. There is some anthropomorphic aspect in it too. |
|
PSF |
Point Spread Function. The “effective shape” of a
photodiode. MTF is the Fourier
transform of the LFS or PSF. |
|
p-type |
Under zero electric field and equilibrium
a p-type semiconductor contains a majority of holes and few electrons. p-type Silicon is usually obtained by doping with acceptor
ions. |
|
push broom imager |
A linear imager scanning a
two-dimensional scene. Often used for earth imaging. |
|
QE |
quantum efficiency Ratio [%] between the number of
generated electrons and the number of impinging photons. Closely related to
spectral response. |
|
QFW, Qsat |
“Full well” (or “saturation”) charge, a term
persisting from the CCD era: the maximum charge a pixel can contain and
readout. Used as a synonym is
saturation charge, the charge at which the pixel saturates. |
|
Qnoise |
Noise charge, generally expressed in
“noise electrons” |
|
random addressing |
A mode of operation of an image sensor,
where pixels are addressed and read individually and randomly, like a RAM or
ROM. |
|
receptor |
The generic name of an elementary
radiation sensitive device. Photodiodes, film grains, eye cones and rods are examples
of light receptors. |
|
rel DE
pixel |
Magnitude of the responsivity of a pixel
referred to the threshold of nominal light detectivity.
Is a measure for the capabilities of a specifications writer.
|
|
reset |
In the imager context, reset means
clearing (emptying) the charge contents of a pixel to the initial dark value.
|
|
response, photo response (PR), responsivity |
What an image sensor or pixel really
does: to respond with a “signal” (typically a signal is a voltage [V] or
a voltage slope [V/s]) as a response to light (“photo”) (typically expressed in W, W/m2,
lx…). The usual units of responsivity are
thus V/W, (V/s)/(W/m2), (V/s)/lx, and alike. Click here for a
view on the contributors to photo response. |
|
RGB |
Red Green Blue: In most color cameras
light is separated in 3 components labeled red, green and blue. This matches
the 3-color sensitivity of the human eye and the 3 phosphor emission of color
TV displays. Alternative, complementary, colors are
sometimes used: Ye (yellow), Cy (cyan) and Ma (magenta). The choice is not
even limited to these 6 colors. |
|
ROI |
Region of interest. See Windowing. |
|
ROIC |
Read out IC: the (often CMOS) readout part of a hybrid
image sensor. |
|
rolling shutter |
Also curtain shutter, blade
shutter. Moving slit mechanical shutter as used in SLR photo cameras.
Ubiquitous type of electronic shutter which does not expose all of the
image's pixels in the same period of time. Contrary of synchronous shutter. |
|
RTS |
Random Telegraph Signal. The noise of a
single trap or interface state, seen in (1) stepwise
two-level variation of MOSFET Vth. Is of the
same origin as MOSFET 1/f noise, presumably interface charge traps modulate
the conductivity of part of the nearby MOSFET channel. (2) stepwise
variations of rate of a generation center. This is seen in pixels with a
random on/off keying of the dark current. the origin
seems to be a geometrically close pair of a generation center and a coulomb
trap. The coulomb trap's state modulates the generation center's rate. Are
often seen as the result of displacement damage by proton or other heavy
particle radiation. |
|
RWI |
Read while integrate Pipelined synchronous shutter |
|
S |
Signal, the output of a pixel or image
sensor, usually in volts [V] |
|
S |
Source.
On of the terminals of a MOSFET. |
|
SF |
Source follower. Near unity gain buffer amplifier very
frequently used in CMOS pixels and CCD, whereby the output is the MOSFET
source, following the input on the MOSFET gate. |
|
SNR S/N |
Signal to noise ratio: Ratio between the
signal (in volts) and the noise level (in voltsRMS). By default, it is understood that S and N
are considered in the same operation point, but often, marketing oriented
people use S at large signal and N at low signal. |
|
saturation (1) |
The light level (the input quantity) or
voltage (the output quantity) at which the pixel has received so much light
that its differential response drops to zero. |
|
saturation (2) |
Property of a color, more or less
synonym to spectral purity. unsaturated colors are
pale or greyish. Back, white and grey have zero saturation. Maximal
saturation occurs for pure spectral colors. The "S" in LHS. |
|
scintillator |
Material in which X- (also γ and
UV-) photons convert into a visible light flash, which are subsequently
detected in an underlying image sensor. |
|
scribe lane/line |
Area between chips/dice on a wafer,
intended to be scribed or sawed. These
~100µm waste gaps are often used for in-process or process validation test
structures. |
|
sensitivity |
The desired property of a good sensor.
The semantic difference with detectivity and
responsivity is not clear. Often
sensitivity is intended to express the ratio between voltage signal (V, V/s)
versus light flux (W/m2, lx), resulting in units as [V/lx.s] or [V.m2/W.s]. |
|
sensor |
"sensing"
apparatus. In our world, a circuit that in some way
is able to sense the amount of
incoming electromagnetic radiation. Most people don't sense a difference with
"detector". |
|
sequencer |
Digital circuit that generates the pulse
trains that are necessary for the proper operation
of an analog imager core. |
|
PSN |
Photon shot noise. The fundamental statistical uncertainty
on the amount of photoelectrons that are generated by light falling on a
photoreceptor. |
|
SLR |
Single Lens Reflex (-camera) |
|
smart pixel |
Pixel with built-in intelligence, which can
be analog or digital operators, event triggering, event counters, smart
reset, systolic arrays, ADC-in-pixels, etc. |
|
smart sensor |
Imager combined with logic, on one chip.
The chip should interpret, rather than just output, the image contents. |
|
SNRmax |
Maximum SNR, whereby the S is taken at
or near saturation, and N in the dark. |
|
SPAD |
Single Photon Avalanche Diode. See APD.
The same as an APD in “Geiger” mode. |
|
spatial noise |
the generic
description of static (non-temporal) non uniformity or variability in the
imager. The three most prominent components are FPN, PRNU and DSNU. See under
these chapters. |
|
SR |
Spectral Response. Response of a photoreceptor as function of
wavelength. In most cases the ratio between the photocurrent and the light
power (or: photo current density and light flux). Expressed in [A/W]. |
|
stitching |
lithographical composition of a large
area image sensor by many exposures of smaller entities |
|
storage gate |
MOSFET gate or CCD electrode that stores
charge in the inversion layer or buried channel underneath. |
|
striations |
(1) year ring
-like modulation of dopant concentration in grown crystals and thus in
wafers. Can sometimes become visible in an image sensor's image, as offset
variations (FPN), as PRNU, or as dark current variations. (2) radial
lithographical faults due to photoresist hindered by the wafer topography
during spinning. |
|
subsampling |
Mode of operation of an image sensor.
Pixels are read sequentially, but not contiguously. I.e. some pixels are
skipped, to obtain an image with lower resolution, and perhaps at a higher
frame rate. |
|
substrate |
The bulk of the integrated circuit. The
"useful" circuits normally lie only on or just below the surface. |
|
SWIR |
Short wavelenght infrared |
|
synchronous shutter |
Also global shutter. A type of
electronic shutter, where all pixels in the imager are sensitivity to light
during exactly the same time span. Differs from the rolling shutter, where
the instant of light sensitivity depends on the pixel's position in the
image.
|
|
tape-out |
In earlier days the (CAD-) design file
was sent to the foundry or the mask shop on a magnetic tape. Today this goes
via email or FTP. |
|
TDI |
Time Delay Integration: Mode of
operation of an area CCD to obtain very high sensitivity when used as line
scan device.. |
|
The black shoe under the table -test |
Quick image sensor test done by hasty
procurement officers at camera system companies to evaluate the low-light
capabilities of a camera or sensor. In
an office, with a comfortable 200 to 1000 lux illumination, the darkest spot
is under the table, the darkest object readily available there is a black
shoe. Does it image well? |
|
The Disneyland set |
Yes! there
exists a publicly accessible calibrated scene for camera evaluation that does
not look like a nearly bankrupt furry animal and grocery shop: Disneyland under a blue sky. Make a set of pictures of your kid in every
attraction while your boss signs the expense note. |
|
TOF |
Time of Flight: a nickname for “distance
ranging” or “3D” cameras based on the capability of each pixel to measure the
distance from the [camera + laser source] to any point in the scene by the
time the light needs to travel form source via object to the imager. |
|
transfer gate |
MOSFET gate or CCD electrode that acts
as a switch preventing or allowing the transfer of (photo-) charge. |
|
trappist |
Benedictine monk, following the rule of
the abbey of La Trappe. Later the beer brewed by these monks. Later the reward
for finding a fatal error in the design of a CMOS image sensor. Later the
name of such an error. http://www.trappist.be/
|
|
twin well |
In a twin well CMOS process, there is of
course the "real" well, but also an implant of opposite type to
increase the doping level of the substrate. All recent CMOS processes are
twin well. A “triple well” is a twin
well combination embedded in a lower doped “tub”. |
|
UDS |
Uncorrelated Double Sampling, as opposed to CDS. See DS. |
|
UV |
Ultra Violet, EM radiation with wavelenghts shorter than the visible light, typically the
range 10nm to 400nm.
In astronomy and meteorology following
terms have some traditional meaning:
|
|
VDD |
Supply voltage of the polarity
associated with "D", the drain of nMOSFETs.
The general supply voltage of an integrated circuit. Typically 5, 3.3, 2.5,
1.8, 1.5, 1.0 and even lower volts referred to GND. |
|
Vacuum tube (CRT-) based image sensor. |
|
|
voltage |
Potential, but corrected for the
material's work function and diffusion potentials, and is thus identical to
the “Fermi potential”. Is measured with a voltmeter. Reference is typically
called “ground” (GND). |
|
VSS |
Supply voltage of the polarity
associated with "S", the source of nMOSFETs.
Typically equal to GND. |
|
Wavefront coding |
Spatially/optically modulate the phase
in the wavefront.
In particular, the technique pioneered by CDM-optics to create TrueFocus, a technique that blurs the image with a
constant amount irrespective the depth of field. After a subsequent digital sharpening step,
the depth-of-field dependent unsharpness is
absent. Thus creating an extended
depth of focus/field in exchange of the S/N loss in de sharpening operation. |
|
well |
In Complementary MOS (CMOS), nMOSFETs and pMOSFETs cannot be
placed in the same substrate. One of them must reside in an area of the
opposite type as the substrate. In a p-type wafer the nMOSFETs
are in the p-type substrate, and the pMOSFETs are
in the n-type (n-)well. |
|
windowing |
A mode of operation of an image sensor,
where only the pixels within a region of interest (ROI) are read out. |
|
wonderbra
image sensor |
Sales demonstration of a mediocre
quality image sensor, where the quality of the resulting images are
"pushed up" by external means like image post-processing, defect
hiding, etc. |
|
X-rays |
In general the electromagnetic radiation
with a wavelength (roughly) shorter than 1 nm. More specifically the
radiation emerging from deceleration of electrons (Bremsstrahlung), which is
the key difference with gamma rays (originating from nuclear reactions) or
cosmic radiations (originating from astronomical objects). |
|
Y |
Luma. As in YUV.
See Luminance. |
|
yield |
The “Y” word, the key specification of
any electronic (and other) component.
The ratio of devices manufactured and devices in spec (or actually
used). |
|
YSNR10 |
Scene illumination in [lx] whereby
SNR=10:1, as measured on the Y (luma) channel. Silent assumptions: after RGB demosaicing
but smoothing and image processing not allowed; the scene is a large, homogenous, grey
18% reflectivity patch; the illuminant is a 6000K blackbody; the lens is a
perfect f-number 2.8 lens. |
|
ZPS |
Zero point something. Term used by Caeleste for pixels or image
sensors that have a read noise far below 1 electronsRMS. |